HI-P (SINGAPORE) TECHNOLOGY PTE. LTD.
Last Updated: 13 Apr 2026
Our company specializes in providing comprehensive manufacturing solutions, including precision tooling, plastic molding, metal-stamping, PCBA, surface decoration, bonding, and joining technologies. We offer a wide range of services, from industrial and product design to secondary operations and process engineering, mass production, full assembly, supply chain management, and distribution. With a focus on both technical competence and business principles, we are committed to delivering high-quality products and services to our customers through a dedicated and skilled workforce.
Country of registration | Singapore |
Registration number | 200107567C |
Local SIC | |
Incorporation date | 22 Nov 2001 |
Company age | 24 years 6 months |
Official entity type | Private Limited Company |
No. of officers | 16 |
Contact
Address:
11 INTERNATIONAL BUSINESS PARK, HI-P BUILDING, Singapore 609926
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This is the legal entity page of HI-P (SINGAPORE) TECHNOLOGY PTE. LTD.. To access company info, company size, news , key makers’ emails, visit the profile pages above.
Associated business (1)
- HI-P INTERNATIONALView MoreSingaporeOur company specializes in providing comprehensive manufacturing solutions, including precision tooling, plastic molding, metal-stamping, PCBA, surface decoration, bonding, and joining technologies. We offer a wide range of services, from industrial and product design to secondary operations and process engineering, mass production, full assembly, supply chain management, and distribution. With a focus on both technical competence and business principles, we are committed to delivering high-quality products and services to our customers through a dedicated and skilled workforce.
This is the legal entity page of HI-P (SINGAPORE) TECHNOLOGY PTE. LTD.. To access company info, company size, news, key maker's emails, visit the profile pages above.
Financials
Auditor | ERNST & YOUNG LLP |
Revenue | > 10m |
Share Capital - Ordinary shares | SGD 1,500,000 |
Last updated: 13 Apr 2026
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