Our company specializes in the production of high-quality 12-inch wafer bumping and wafer level packaging services for the semiconductor industry. We utilize cutting-edge technology and equipment to ensure precise and reliable processing, meeting the demands of leading manufacturers worldwide.
Headquarters:
Singapore
Company Type:
SME
Company size:
51-200 Employees
Employees by Department
- IT / Product (5)
- Sales (1)
- The Rest (11)
- Total (17)
Key Decision Makers
Insight
- Operates in multiple countries
Financials
HIGH
spending power
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Frequently Asked Questions (FAQ)
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