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ExportedOur company specializes in the production of high-quality 12-inch wafer bumping and wafer level packaging services for the semiconductor industry. We utilize cutting-edge technology and equipment to ensure precise and reliable processing, meeting the demands of leading manufacturers worldwide.
Headquarter Singapore |
Countries of operation Singapore, Philippines |
Funding status Private |
Company type SME |
NPI Team Leader - FOPLP (Fan-Out Panel Level Packaging) Semiconductor Business Unit
Process Manager
Production Supervisor
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Job title | Name | Email | Country based in | Job Function | Seniority | |
|---|---|---|---|---|---|---|
NPI Team Leader - FOPLP (Fan-Out Panel Level Packaging) Semiconductor Business Unit | - | hidden.item | hidden.item | hidden.item | ||
Process Manager | - | hidden.item | hidden.item | hidden.item | ||
Production Supervisor | - | hidden.item | hidden.item | hidden.item |
