Pac Tech, a member of the Nagase group, is a global leader in providing cutting-edge wafer bumping, packaging, and solder ball placement solutions. We offer top-notch contract services for low-cost wafer-level bumping and packaging, ensuring high quality at competitive prices.
Headquarters:
Malaysia
Company Type:
SME
Company size:
11-50 Employees
Employees by Department
- IT / Product (3)
- Operations (2)
- The Rest (5)
- Total (10)
Key Decision Makers
Insight
- Operates in multiple countries
Financials
LOW
spending power
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Featured Lists
- SMEs in Singapore
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Frequently Asked Questions (FAQ)
- What is the funding status of PAC TECH ASIA SDN. BHD.?
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- What PAC TECH ASIA SDN. BHD.'s spending power?
- Does PAC TECH ASIA SDN. BHD. have a presence in the domain it operates in?
