BONDPLAS ENGINEERING
Last Updated: 13 Apr 2026
BONDPLAS ENGINEERING is ACRA -registered entity that has been operating for 22 years 6 months in Singapore since its incorporation in 2003.
Officially, BONDPLAS ENGINEERING is registered as Partnership with its address 20 WOODLANDS LINK, #08-16, Singapore 738733.
Country of registration | Singapore |
Registration number | 53008004D |
Local SIC | |
Incorporation date | 13 Nov 2003 |
Company age | 22 years 6 months |
Official entity type | Partnership |
No. of officers | 2 |
Contact
Address:
20 WOODLANDS LINK, #08-16, Singapore 738733
Phone number:
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Associated business (1)
BONDPLAS ENGINEERINGView MoreSingapore
This is the legal entity page of BONDPLAS ENGINEERING. To access company info, company size, news, key maker's emails, visit the profile pages above.
Financials
Revenue | < 1m |
Last updated: 13 Apr 2026
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