Legal Entity
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BONDPLAS ENGINEERING
Last Updated: 30 Oct 2026
BONDPLAS ENGINEERING is ACRA -registered entity that has been operating for 22 years 11 months in Singapore since its incorporation in 2003.
Officially, BONDPLAS ENGINEERING is registered as Partnership with its address 20 WOODLANDS LINK, #08-16, Singapore 738733.
Country of registration | Singapore |
Registration number | 53008004D |
Local SIC | |
Incorporation date | 13 Nov 2003 |
Company age | 22 years 11 months |
Official entity type | Partnership |
No. of officers | 2 |
Contact
Address:
20 WOODLANDS LINK, #08-16, Singapore 738733
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Associated business (1)
BONDPLAS ENGINEERINGView MoreSingapore
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Financials
Revenue | < 1m |
Last updated: 30 Oct 2026
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