We are the pioneers of laser dicing and grooving technology for the semiconductor industry, offering cutting-edge systems that leverage our proprietary multi-beam laser dicing method. This innovative approach enables precise, efficient, and cost-effective production, allowing clients to stay ahead o...See more
Headquarter United States of America |
Countries of operation United States of America, Singapore, Philippines |
Year founded 2001 (23 years) |
Funding status Publicly listed on stock exchange |
Company type MNC / Large Enterprise |
Technical Manager (Laser & Optics)
Property Specialist