Tezzaron® Semiconductor Corporation is a leader in 3D wafer stacking and TSV (Through Silicon Via) processes. We have successfully demonstrated the world's first wafer-stacked 3D-ICs, including stacked microprocessors, sensors, and SRAM devices. With our DiRAM4 prototype complete, we are now focused...See more
Headquarter United States of America |
Countries of operation Singapore, United States of America |
Year founded 1999 (25 years) |
Funding status Private |
Company type SME |
Managing Director